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Vertical Continuous Plating

Additionally, to strengthen our capabilities in process, people, and technology, Epitome has commissioned a state-of-the-art “Vertical Continuous Plating” line (VCP). It is a new-generation electroplating technology in the PCB manufacturing process, equipped with PLC-based automatic operation, automatic chemical dosing, and alarm functions:

• Excellent plating uniformity i.e. <6um range of plating distribution & COV >95%.
• High throwing power >92%.
• Real-time status monitoring and alarm functions.
• High efficiency and safe operations compared to traditional plating lines.
• The Eductor mechanism for chemical agitation ensures better solution flow through holes to get high throwing power and avoids propagation delays.